Company Advantages
1. Crafted precisely in our modernized facility, ADV buried vias pcb is manufactured with the finest workmanship at a lower cost. Being laminated by advanced vacuum lamination equipment, it has a uniform dielectric thickness after lamination
2. The product is well-known and widely accepted for its great economic benefits. It is lead-free and environmental-friendly and has passed SGS test
3. The amount of light being reflected from its surface is always sufficient. Its surface is generally coated with barium sulfate or titanium dioxide accompanied by magnesium carbonate. It is extremely popular in the markets of Europe, North America, and Asia
4. It ensures HD visuals. It boasts a proper gain of reflectivity, providing the widest possible viewer angles with perfect diffusion uniformity. The product has dynamic and mechanical stability
5. The product takes full advantage of the expertise of acoustics. The retractable seal on the top and bottom can effectively interlock together to achieve the desired acoustic seal. With a solder mask, it enjoys a good electrical insulation property

Via In Pad (VIP) technology refers to the vias in SMD pad or BGA pad due to small space for layout, in order to avoid the solder paste flow into inner layer or the other side in assembly production, basically this type of via need to be plugged with resin and plate copper over to cap the via to make it invisible.

Via in pad technology is widely used in high density PCBs, especially for the PCBs that require a limited BGA space and are focused on heat transfer and high speed design. Although blind holes and buried holes help increasing density and save space on the circuit boards, through holes are still the best choice for thermal management and high speed design elements.

The advantages of Via In Pad technology

● Suitable for fine pitch BGAs
● Improved thermal dissipation
● Provides a flat, coplanar surface for component attachment
● Leading to higher density of PCBs and promoting space saving
● Overcomes high speed design issues and constraints.
● Meets closely packed placement requirements.

The Via In Pad technology is defined in IPC standard with IPC-4761 VII

ADV manufactured lots of multilayer PCBs with Via In Pad designs Both in BGA Pads or in other SMD Pads, we’re able to plugged vias fully and then plated copper over to make the surface of pad as flat as other pads without dimples.

Company Features
1. Shenzhen ADV Technology Co., Ltd. is one of the main entities focused on the production of edge plating pcb . Shenzhen ADV Technology Co., Ltd. has professional technical personnel to undertake blind vias pcb solutions.
2. Shenzhen ADV Technology Co., Ltd. is recognized both in quality and technology.
3. Advanced technology of buried vias pcb has been applied to the production of impedance control pcb . Shenzhen ADV Technology Co., Ltd. has always adhered to the fine traditions of press fit pins pcb , and it has been strict throughout the whole process of business management. Get an offer!